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Electronic components can fail in a variety of ways. These can be categorized in a variety of ways, including by time or reason. Excessive temperature, current or voltage, ionizing radiation, mechanical shock, stress or impact, and a variety of other factors can lead to failure. Problems in the device package can cause failures in semiconductor devices owing to contamination, mechanical stress, or open or short circuits.
Failures are more common around the beginning and end of a part's lifetime, resulting in a failure rate graph that looks like a bathtub. Early failures are detected via burn-in processes. In semiconductor devices, parasitic structures that are unimportant during normal operation become crucial during breakdowns.
Which term refers to any arrangement of a source of electricity a conductor a switch and a load/device?
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